Status of industrial ceramics in IC industry

Issuing time:2017-09-06 11:12
IC,thatis,integratedcircuits,from the birth of the first transistor in 1947 has been 70 years, the development of more than half a century, to promote the modern intelligent road. IC mainly consists of three parts, electronic components, substrates, packaging tubes and shells. What we're talking about today is the other two main categories besides the electrical components - the substrate and the package shell.

工业陶瓷在IC行业的地位

The attention of these two pieces has never been higher than electronic components, probably because the packaging and substrate appear to be very technical, but everyone may have overlooked the essence.

Integrated circuits, as the name suggests, should be integrated. A lot of people when all lived in rural house, then the main housing is perhaps 32 bungalows, play the function of the bedroom door, the small courtyard put on a pair of tables and chairs, as the living room, next to a small smoke house, the kitchen, and has the unique function of the toilet, need to have the isolation, may be in the house behind to walk ten meters...... Later, to the city, or rural urbanization, we all live in a building or a suite, a suite, a living room, bedroom, kitchen, bathroom, balcony, perhaps only tens of square meters, it has various functions of the original area of several hundred square meters of rural housing, which is integrated. The integrated circuit than the more exaggerated, the integration is far from a suite can be compared, perhaps with a modern building can be a better analogy: there are shops, office, canteen, hotel style apartments on the ground, underground layers of parking lot, parking lot also below the foundation -- this is the integrated circuit layout.

The packaging and substrate are equivalent to the whole building's frame, which is the rigid standard for determining the volume area of IC. At present, there are only three kinds of materials for packaging and substrate Government: plastic, metal and industrial ceramics. What we are going to talk about today is industrial ceramics.

The ceramic substrate and the ceramic package is relatively higher than the other two kinds of materials in terms of words is the bright younger generation, but the Yangtze River push waves after waves, the waves die on the beach. The popularization and application of industrial ceramics are much faster than those of plastics and metals, and industrial ceramics have their unique unique advantages, whether in the substrate or in the packaging field.

Power electronic devices are now facing not only a greater maximum in the direction to go, then the heat is bound to bear the brunt of the problem, not solve the problem of heat dissipation, all thoughts can only be empty talk, and for cooling the industrial ceramics is the field of the king, whether it is a metal substrate or plastic substrate, thermal conductivity the coefficient in the single digits, and the ceramic substrate, the thermal conductivity can reach 170-230.

From the point of view of thermal expansion coefficient, the ceramic substrate will be closer to silicon, and the volume change at the temperature is basically the same as that of the electronic components. It will not lead to problems caused by thermal expansion and cold contraction. In the field of communications, the dielectric constant of industrial ceramics is very small, the relative dielectric loss is also very small, and in the upcoming 5G, will bring the field of communication on the ceramic substrate fanaticism.

In the field of packaging, ceramic packaging applications than ceramic substrate slightly wider, such as COB, CDIP, CQFP and so on, but this piece of domestic attention is not so much, resulting in a large recall of 2017 of LED exports. No matter LED, in other areas, too, we must guarantee the quality and the foundation to build skyscrapers.

IC is a very big one. As for the future, industrial ceramic materials can become a killer, or replace two other materials, which is not known. But ceramics are bound to dominate in the IC industry.